Invisible to infrared cameras: first three-dimensional thermal cloak
Researchers in Illinois and Denmark steer heat around a hidden object. The technique could help cool microchips and shield equipment from extreme temperatures.
Symbolic image · Photo: Asurnipal / Wikimedia Commons, CC BY-SA 4.0 (cropped and resized)
Researchers at the University of Illinois Urbana-Champaign and the Technical University of Denmark say they have built the first three-dimensional thermal invisibility cloak. Earlier versions worked only in two dimensions or for heat coming from one direction. The study was published in Nature Communications.
Rather than blocking heat, the device guides it around the hidden object so an infrared camera sees a normal temperature pattern. The team built a 3D-printed aluminum lattice filled with a poorly conducting, rubber-like material and used it to conceal even complex shapes such as heads. "A real thermal cloak should work no matter where the heat comes from," said Professor Xiaojia Shelly Zhang.
The researchers cite applications such as drawing heat away from sensitive electronic components and microchips and shielding equipment from extreme temperatures. They also mention concealment from thermal cameras as a possible future use.